Heat dissipation device and uav using the same

ABSTRACT

An unmanned aerial vehicle (UAV) includes a heat dissipation device, an inertial measurement unit (IMU), and a control module. The heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow, and the heat conduction plate directly constitutes a portion of a sidewall of the air duct. The IMU module is received within the air duct. The control module is located outside the air duct and disposed at a side of the heat conduction plate that faces away from the IMU module. Heat generated by the IMU module is taken away directly by the airflow within the air duct.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of application Ser. No.15/448,782, filed on Mar. 3, 2017, which is a continuation applicationof International Application No. PCT/CN2014/086628, filed on Sep. 16,2014, the entire contents of both of which are incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to a heat dissipation device and, inparticular, to a heat dissipation device having an air channel tube andan unmanned aerial vehicle (UAV) using the same.

BACKGROUND

For an unmanned aerial vehicle (UAV), such as a multi-rotor all-in-onevehicle, a main control system is generally required to have a compactstructure in order to reduce the mass and volume of the all-in-onevehicle as much as possible. The main control system can comprise aninertial measurement unit (IMU) module and an orthogonalfrequency-division multiplexing (OFDM) module. Various modules (forexample, the IMU module and the OFDM module) of the main control systemare deployed in an integral space as far as possible.

However, the modules of the main control system normally may generateheat when operating. In such a closed space of the UAV, if the heat isnot dissipated timely, it may cause an environment temperature of themain control system to increase. Moreover, each of the modules of themain control system may have a respective requirement for theenvironment temperature in order to operate normally, an electronicmodule generating more heat may impact an electronic module generatingless heat. For example, the amount of heat generated by the IMU moduleis usually lower than that generated by the OFDM module. Therefore, forthe above-described reasons, the main control system may not to be ableto operate in a good operating state or to operate normally.

SUMMARY

In view of the above, the present disclosure provides a heat dissipationdevice which is capable of reducing an overall temperature of a maincontrol system of an unmanned aerial vehicle (UAV) and avoiding the heatgenerated by a module of the main control system from influencinganother module of the main control system.

In accordance with the present disclosure, there is provided a heatdissipation device including an air guiding cover and a heat conductionplate. The air guiding cover includes an air duct configured to guide anairflow and including a mounting window formed on a sidewall of the airduct, an air inlet formed at a first end of the air duct, and an airoutlet formed at a second end of the air duct. The heat conduction plateis disposed at the mounting window and covers the mounting window.

In some embodiments, the air inlet and the air outlet are disposedopposite to each other.

In some embodiments, an opening size of the air inlet is greater than anopening size of the air outlet.

In some embodiments, the sidewall includes a plane-shaped mountingsidewall on which the mounting window is formed, and the heat conductionplate includes a plane-shaped plate body covering the mounting window.

In some embodiments, the mounting window extends from the first end ofthe air duct to the second end of the air duct, and extends all the waythrough the air outlet. The plate body extends to the air outlet andforms the air outlet jointly with other sidewalls of the air duct.

In some embodiments, the heat dissipation device further includes amidstream guiding face formed at a middle section of another sidewall ofthe air duct and configured to converge the airflow towards the airoutlet. The other sidewall is opposite to the sidewall on which themounting window is formed.

In some embodiments, the midstream guiding face includes a convex curvedface or an inclined plane.

In some embodiments, the heat dissipation device further includes anupstream guiding face formed on another sidewall of the air duct at alocation close to the air inlet and configured to converge an airflowfrom the air inlet towards a middle section of the air duct. The othersidewall is opposite to the sidewall on which the mounting window isformed.

In some embodiments, the upstream guiding face includes a convex curvedface or an inclined plane.

In some embodiments, the heat conduction plate comprises a plate bodysealing the mounting window and a plurality of heat dissipation finsdisposed on a surface of the plate body that faces the air duct.

In some embodiments, a hollow region is formed among the plurality ofheat dissipation fins.

In some embodiments, the plurality of heat dissipation fins are disposedsubstantially in parallel and spaced apart from each other to form aplurality of flow guiding grooves which are disposed along an extendingdirection parallel to the air duct.

In some embodiments, the heat dissipation device further includes aplurality of fixing bosses provided on a surface of the plate body thatfaces the air duct and fixedly connected with at least one of othersidewalls of the air duct to fix the heat conduction plate on the airguiding cover. One or more of the fixing bosses are fixedly connectedwith a corresponding one of the heat dissipation fins.

In some embodiments, the at least one of other sidewalls of the air ductprotrude outwardly to form a plurality of positioning slots. Theplurality of fixing bosses respectively match the plurality ofpositioning slots.

In some embodiments, the heat conduction plate is detachably connectedwith the air guiding cover.

In some embodiments, the heat conduction plate is fixedly connected withthe air guiding cover via a snap structure.

In some embodiments, the heat conduction plate is fixedly connected withthe air guiding cover via a threaded fastener.

In some embodiments, the heat conduction plate includes a mountingportion for fixing an electronic module and provided on a surface of theheat conduction plate that faces away from the air duct.

In some embodiments, the air guiding cover further includes a flowguiding plate disposed within the air duct. A flow guiding face of theflow guiding plate is disposed aslope relative to an extending directionof the air duct to form a flow converging portion with a graduallynarrowing width at a middle section of the air duct. An end of the flowconverging portion with a larger width is disposed towards the airinlet.

In some embodiments, the flow guiding plate includes a main plate bodyand a connecting plate disposed at a back side of the main plate body.The connecting plate is fixedly connected with another sidewall of theair duct to fix the flow guiding plate within the air duct. The flowguiding face includes a front side of the main plate body.

In some embodiments, the flow guiding plate includes a main plate bodyand a hook located on an edge of the main plate body. The flow guidingface includes a front side of the main plate body. The air duct includesa snap structure on another sidewall of the air duct. The hook issnapped with the snap groove to fix the main plate body within the airduct.

In some embodiments, the flow guiding face includes a concave arc face,a convex arc face, or a plane.

In some embodiments, the flow guiding face is disposed in a directionperpendicular to the sidewall of the air duct.

In some embodiments, the flow guiding face is disposed opposite to thesidewall of the air duct.

In some embodiments, the heat dissipation device further includes amounting support located within the air duct and configured to mount anelectronic module within the air duct.

In some embodiments, the mounting support is fixedly connected with asurface of the heat conduction plate that faces the air duct.

In some embodiments, the mounting support includes a thermal insulationsupport and is detachably connected with the heat conduction plate.

In some embodiments, the mounting support includes a U-shaped plate bodyincluding a hollow portion for heat dissipation and fixing lugs formedat two ends of the U-shaped plate body. A clamping space is formedwithin the U-shaped plate body. The fixing lugs bend from the two endsof the U-shaped plate body and extend in opposite directions. The fixinglugs are fixedly connected with the surface of the heat conduction platethat faces the air duct.

In some embodiments, the mounting support includes a plurality ofL-shaped frames. One end of each of the L-shaped frames is fixed on thesurface of the heat conduction plate that faces the air duct. Anotherend of each of the L-shaped frames is disposed in parallel to and spacedapart from the heat conduction plate. A clamping space is formed betweentwo of the L-shaped frames that are disposed opposite to each other.

In some embodiments, the mounting support is fixedly connected with thesidewall of the air duct.

In some embodiments, the heat dissipation device further includes a fanconfigured to blow the airflow into the air duct via the air inlet.

In some embodiments, the fan is mounted at the air inlet, and a wind-outface of the fan is disposed towards the air duct such that the fan isdirectly in communication with the air inlet.

In some embodiments, the air inlet includes a plurality of positioningposts arranged at an opening end face of the air inlet. The fan includesa plurality of positioning holes arranged at an edge of the fan andcorresponding to the positioning posts. The plurality of positioningposts pass through the plurality of locating holes, respectively, toposition the fan on the opening end face of the air inlet.

In some embodiments, the heat dissipation device further includes a fansupport via which the fan is fixed on an opening end face of the airinlet.

In some embodiments, the heat dissipation device further includes a flowguiding channel connecting the fan with the air inlet.

In some embodiments, the heat dissipation device further includes amounting housing disposed at a side of the heat conduction plate thatfaces away from the air duct. The mounting housing and the heatconduction plate jointly form an electrical box.

In some embodiments, the mounting housing includes a bottom platedisposed opposite to the heat conduction plate and a plurality of sideplates connected with edges of the bottom plate and connected to eachother in sequence to enclose an loop-like closed structure. Edges of theplurality of side plates that are distal from the bottom plate form anopening having a shape matching a shape of an outline of the heatconduction plate.

In some embodiments, the bottom plate includes at least one of aconnecting window configured to receive an external plug or a heatdissipation window configured to expose an electronic component arrangedin the electrical box.

In some embodiments, the heat dissipation device further includes aconnecting support fixedly connecting the heat conduction plate and themounting housing.

In some embodiments, the connecting support includes a Z-shapedstructure and includes a connecting body and two fixing portionsdisposed at two ends of the connecting body, respectively, and fixedlyconnected with the heat conduction plate and the mounting housing,respectively.

In some embodiments, the mounting housing includes a snap hole at one ofthe side plates. The connecting body includes a sheet-shaped structure.The two fixing portions include folded sheets bending and extending fromthe two ends of the connecting body. One of the two fixing portions isinserted in the snap hole, and the other one of the two fixing portionsis disposed clingingly at a surface of heat conduction plate that facesthe air duct.

In some embodiments, the heat dissipation device further includes atleast one fixing support configured to fix the air guiding cover.

In some embodiments, the at least one fixing support includes a firstfixing support fixedly connected with the air guiding cover and a secondfixing support fixedly connected with the heat conduction plate.

In some embodiments, the at least one fixing support includes a U-shapedbody and two connecting lugs. The U-shaped body includes a bottom andtwo arm extending from two ends of the bottom, respectively, towards asame side of the bottom. The two connecting lugs are disposed spacedapart from and opposite to each other, and extend in a directionperpendicular to the bottom and facing away from the arms of theU-shaped body.

Also in accordance with the present disclosure, there is provided anunmanned aerial vehicle (UAV) including any of the heat dissipationdevice described above, a first electronic module arranged in the heatdissipation device, and a second electronic module arranged in the heatdissipation device and separated from the heat dissipation device.

In some embodiments, the first electronic module generates more heatthan the second electronic module when the UAV operates.

In some embodiments, the first electronic module generates less heatthan the second electronic module when the UAV operates.

In some embodiments, the UAV further includes a third electronic moduledisposed at a side of the second electronic module that faces away fromthe heat conduction plate.

In some embodiments, the first electronic module includes an inertialmeasurement unit module, the second electronic module includes anorthogonal frequency-division multiplexing module, and the thirdelectronic module includes a control module. The first, second, andthird electronic modules form a main control module of the UAV.

In some embodiments, the first electronic module includes an inertialmeasurement unit module and the second electronic module includes anorthogonal frequency-division multiplexing module.

A heat dissipation device according to the present disclosure has atleast the following advantages:

(1) The heat dissipation device according to the present disclosuredissipates the heat generated by a plurality of electronic modulesseparately, thereby preventing the heat generated by one electronicmodule from influencing another electronic module, such that theplurality of electronic modules can operate in different environmentaltemperatures. Further, the heat generated by various electronic modulescan be taken away quickly via the airflow circulating within the airduct of the air guiding cover.

For example, an IMU module is disposed within the air duct of the airguiding cover. The heat generated by the IMU module can be taken awaydirectly by the airflow within the air duct of the air guiding cover. AnOFDM module is located outside the air guiding cover and fixed on theheat conduction plate. The heat generated by the OFDM module isconducted to the heat conduction plate and taken away by the airflowwithin the air duct of the air guiding cover.

(2) The heat conduction plate of the heat dissipation device accordingto the present disclosure directly constitutes a portion of thesidewalls of the air duct of the air guiding cover, such that the heatgenerated by an electronic module can be dissipated directly via theheat conduction plate, thereby improving the heat dissipation efficiencyfor the electronic module.

(3) The electronic module is fixed directly on the heat conductionplate, which is fixed on the air guiding cover. This allows theelectronic module to be more firmly fixed in the UAV, thus avoiding badelectrical contact in the electronic module when the UAV flies andvibrates. Further, the strength of the whole structure of the UAV isenhanced, meeting the requirement of the strength on the structure ofthe UAV.

As compared to a traditional UAV, a UAV according to the presentdisclosure has at least the following advantages:

(1) The UAV according to the present disclosure employs a heatdissipation device to dissipate the heat generated by a plurality ofelectronic modules separately, thereby preventing the heat generated byone electronic module from influencing another electronic module, suchthat the plurality of electronic modules can operate in differentenvironmental temperatures. Further, the heat generated by variouselectronic modules can be taken away quickly via the airflow circulatingwithin the air duct of the air guiding cover.

For example, an IMU module is disposed within the air duct of the airguiding cover. The heat generated by the IMU module can be taken awaydirectly by the airflow within the air duct of the air guiding cover. AnOFDM module is located outside the air guiding cover and fixed on theheat conduction plate. The heat generated by the OFDM module isconducted to the heat conduction plate and taken away by the airflowwithin the air duct of the air guiding cover.

(2) The heat conduction plate of the above-described heat dissipationdevice directly constitutes a portion of the sidewalls of the air ductof the air guiding cover, such that the heat generated by the secondelectronic module can be dissipated directly via the heat conductionplate, thereby improving the heat dissipation efficiency for the secondelectronic module.

(3) The second electronic module of the above described UAV is fixeddirectly on the heat conduction plate, which is fixed on the air guidingcover. This allows the second electronic module to be more firmly fixedin the UAV, thus avoiding that bad electrical contact in the secondelectronic module when the UAV flies and vibrates. Further, the strengthof the whole structure of the UAV is enhanced, meeting the requirementof the strength on the structure of the UAV.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structural diagram showing a UAV according to an embodimentof the present disclosure.

FIG. 2 is a cross sectional view of the UAV as shown in FIG. 1.

FIG. 3 is an exploded view of the UAV as shown in FIG. 1.

FIG. 4 is an exploded view of the UAV as shown in FIG. 1 at anotherangle of view.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present disclosure will be described inmore detail below in combination with the drawings. It should beapparent that the exemplary embodiments described herein are only a partrather than all of the embodiments of the present disclosure. All otherembodiments obtained by those having ordinary skills in the art on thebasis of the exemplary embodiments described herein without anyinventive efforts should fall within the scope of the presentdisclosure.

It should be noted that, when a component is referred as “being fixedto” another component, the component may be directly on, e.g.,contacting, the other component, or there may be an intermediatecomponent therebetween. When a component is referred as “connectingwith/to” another component, the component may be directly connected to,e.g., contacting, the other component or there may be an intermediatecomponent therebetween. Terms such as “perpendicular,” “horizontal,”“left,” “right,” and the like as used herein are merely for illustrativepurposes.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meanings as those skilled in the art generally understand.The terms used in the present disclosure are merely for the purpose ofdescribing specific embodiments, and not intended to limit the presentdisclosure. The term “and/or” used herein may comprise any or all of thecombinations of one or more related items listed.

Consistent with embodiments of the present disclosure, there is provideda heat dissipation device that may be applied in a unmanned aerialvehicle (UAV) to dissipate heat generated by electronic modules in theUAV, such as an inertial measurement unit (IMU) module, an orthogonalfrequency-division multiplexing (OFDM) module, and a control module of amain control system in the UAV.

The heat dissipation device may comprise an air guiding cover and a heatconduction plate. The air guiding cover forms an air duct which has anair inlet and an air outlet. The heat conduction plate constitutes apart of the air duct. When the UAV has two different electronic modules,one of the two different electronic modules is received within the airduct and the heat generated by the one is taken away directly by anairflow within the air duct. Another one of the two different electronicmodules is located outside the air duct and connected with the heatconduction plate, and the heat generated by the another one is conductedonto the heat conduction plate, then taken away by the airflow withinthe air duct.

In some embodiments, an opening size of the air inlet is greater thanthat of the air outlet, such that an airflow velocity at the air inletis smaller than that at the air outlet.

In some embodiments, the size of the cross-section of the air duct isnot uniform. In some embodiments, the airflow at a place where thecross-section has a greater size is slower, increasing the duration ofheat exchange with the airflow. The airflow at the place where thecross-section has a smaller size is faster, decreasing the duration ofheat exchange with the airflow.

For example, a midstream guiding face is formed at a middle section of asidewall of the air duct that is opposite to a mounting window. Anupstream guiding face is formed at a position, which is close to the airinlet, of the sidewall of the air duct that is opposite to the mountingwindow, to change the cross-sectional size of the air duct.

In some embodiments, a flow guiding plate is provided within the airduct of the air guiding cover to change a flowing direction of theairflow within the air duct.

In some embodiments, a flow guiding face of the flow guiding plate maybe disposed in a variety of ways. For example, the flow guiding face isdisposed in a direction perpendicular to a sidewall of the air duct thatis provided with the mounting window. In some other embodiments, theflow guiding face is provided opposite to the sidewall of the air ductthat is provided with the mounting window.

In some embodiments, the flow guiding face of the flow guiding plate maybe in a variety of shapes. The flow guiding face may be a concave arcface, a convex arc face, or a plane.

In some embodiments, the shape of the heat conduction plate may beplanar or curved.

In some embodiments, the heat conduction plate may be a separate platebody component or one of side plates of an electrical box.

In some embodiments, the heat conduction plate is disposed in thermalinsulation with an electronic module mounted within the air duct. Forexample, the heat conduction plate is spaced apart from the electronicmodule mounted within the air duct. In some embodiments, a thermalinsulation material is provided between the heat conduction plate andthe electronic module mounted within the air duct.

In some embodiments, the heat dissipation device may further comprise amounting support for fixing the electronic module. The mounting supportis erected within the air duct of the air guiding cover.

The mounting support may be fixed on a sidewall of the air duct of theair guiding cover or on the heat conduction plate.

In some embodiments, the heat dissipation device further comprises a fanfor generating the airflow to dissipate heat.

The fan may be directly in communication with the air duct. For example,the fan is directly mounted at the air inlet of the air duct. The fanmay be indirectly in communication with the air duct. For example, thefan is disposed at another portion of the UAV, and in communication withthe air duct of the air guiding cover via a flow guiding channel insidethe UAV.

Some embodiments of the present disclosure will be described in detailbelow in conjunction with the drawings.

Referring to FIG. 1 and FIG. 2, a UAV 10 according to an embodiment ofthe present disclosure may comprise a heat dissipation device 100, afirst electronic module 200, and a second electronic module 300.

The heat dissipation device 100 may comprise an air guiding cover 110and a heat conduction plate 120 which is fixedly connected with the airguiding cover 110. The air guiding cover 110 and the heat conductionplate 120 may isolate the first electronic module 200 from the secondelectronic module 300 and meanwhile dissipate the heat generated by thefirst electronic module 200 and the second electronic module 300. Forexample, in the illustrated embodiment, the first electronic module 200is received within the air guiding cover 110 and disposed spaced apartfrom the heat conduction plate 120. The second electronic module 300 isdisposed on an outer surface of the heat conduction plate 120. The outersurface of the heat conduction plate 120 faces away from the air guidingcover 110. The heat generated by the second electronic module 300 may beconducted to the heat conduction plate 120, while the heat in the heatconduction plate 120 and the heat generated by the first electronicmodule 200 can be taken away by an airflow circulating within the airguiding cover 110.

Referring to FIG. 3 and FIG. 4, the air guiding cover 110 may comprisean air duct 111 for guiding the airflow, and an air inlet 112 and an airoutlet 113 formed at two ends of the air duct 111, respectively. Amounting window 114 may be provided on and through a sidewall of the airduct 111.

An opening size of the air inlet 112 and an opening size of the airoutlet 113 may not be equal to each other. In the illustratedembodiment, the opening size of the air inlet 112 is greater than theopening size of the air outlet 113.

The positions of the air inlet 112 and the air outlet 113 may bedesigned according to different requirements. For example, in theillustrated embodiment, the air inlet 112 may be disposed opposite tothe air outlet 113 to decrease a resistance endured by the airflowpassing through the air duct 111, further improving a heat dissipationefficiency of the heat dissipation device 100.

The heat conduction plate 120 may be used for fixing the secondelectronic module 300. The heat conduction plate 120 may be disposed atthe mounting window 114 of the air guiding cover 110 and cover themounting window 114 of the air guiding cover 110. In the illustratedembodiment, the air duct 111 has a plane-shaped mounting sidewall 119 onwhich the mounting window 114 is provided. The heat conduction plate 120may comprise a plane-shaped plate body 121 which seals the mountingwindow 114.

Further, the mounting window 114 of the air guiding cover 110 may extendfrom an end of the air guiding cover 110 where the air inlet 112 isformed to an end of the air guiding cover 110 where the air outlet 113is formed, and extend all the way through the air outlet 113. The platebody 121 may extend to the air outlet 113 and form the air outlet 113jointly with sidewalls of the air duct 111. Since the heat conductionplate 120 occupies a great proportion of the mounting sidewall 119 ofthe air guiding cover 110, the contact area of the heat conduction plate120, with which the air can contact, is increased, further improving theheat dissipation efficiency of the heat dissipation device 100.

Further, a midstream guiding face 111 b may be formed on a middlesection of the sidewall of the air duct 111 that is opposite to themounting window 114. The midstream guiding face 111 b may be an inclinedplane provided on a sidewall of the air duct 111 to enable the airflowing towards the air outlet 113 to gradually converge. For example,in the illustrated embodiment, the first electronic module 200 islocated at a position in an upstream of the midstream guiding face 111b, such that the air, after absorbing the heat generated by the firstelectronic module 200, flows towards the air outlet 113 as quickly aspossible, to avoid the heat carried by the airflow from being dissipatedreversely to the first electronic module 200. This further preventingthe heat generated by one of the first electronic module 200 and thesecond electronic module 300 from influencing the other one of the firstelectronic module 200 and the second electronic module 300.

The midstream guiding face 111 b may be designed according to adifferent requirement to have a shape different from that shown in thefigures and described above. For example, the midstream guiding face 111b may be a convex curved face provided on the sidewall of the air duct111.

Further, an upstream guiding face 111 c which is close to the air inlet112 may be formed on a sidewall of the air duct 111 that is opposite tothe mounting window 114. In the illustrated embodiment, the upstreamguiding face 111 c is an inclined curved face provided on the sidewallof the air duct 111, to enable the air flowing towards the middlesection of the air duct 111 from the air inlet 112 to graduallyconverge. For example, in the illustrated embodiment, the firstelectronic module 200 is located at a position which is downstream ofthe upstream guiding face 111 c. This increases the speed of the airflowing towards the first electronic module 200, thereby furtherimproving the heat dissipation efficiency for the first electronicmodule 200.

The upstream guiding face 111 c may be designed according to a differentrequirement to have a shape different from that shown in the figures anddescribed above. For example, the upstream guiding face 111 c can be aconvex curved face provided on the sidewall of the air duct 111.

Further, the heat conduction plate 120 may also comprise a plurality ofheat dissipation fins 123 disposed on a surface of the plate body 121that faces the air duct 111 to increase the contact area of the airwithin the air duct 111 of the air guiding cover 110 with the heatconduction plate 120, thereby improving the heat dissipation efficiencyof the heat conduction plate 120.

In some embodiments, as shown in the figures, the plurality of heatdissipation fins 123 are provided with a hollow region 123 a formounting the first electronic module 200.

The extending directions of the plurality of heat dissipation fins 123may be designed according to different requirements. For example, in theillustrated embodiment, the plurality of heat dissipation fins 123 aredisposed in parallel and spaced apart to form a plurality of flowguiding grooves 122 which are disposed along an extending directionparallel to the air duct 111. Disposing the flow guiding grooves 122along the extending direction parallel to the air duct 111 reduces theresistance on the airflow within the air duct 111 passing through theplurality of heat dissipation fins 123, thereby further improving theheat dissipation efficiency of the heat conduction plate 120.

The heat conduction plate 120 may be detachably connected with the airguiding cover 110. The connecting manner of the heat conduction plate120 and the air guiding cover 110 may be designed according to differentrequirements. For example, the heat conduction plate 120 and the airguiding cover 110 can be fixedly connected together via a snap structureor a threaded fastener.

In the illustrated embodiment, a plurality of fixing bosses 125 areprovided on the surface of the plate body 121 that is close to, i.e.,that faces, the air duct 111 of the air guiding cover 110. In someembodiments, at least some of the plurality of fixing bosses 125 arefixedly connected with the heat dissipation fins 123. In someembodiments, at least some of the plurality of fixing bosses 125 areformed integrally with the heat dissipation fins 123. The plurality offixing bosses 125 are fixedly connected with the sidewall of the airduct 111 of the air guiding cover 110 to fix the heat conduction plate120 on the air guiding cover 110.

Further, sidewalls of the air duct 111 may protrude outwardly to form aplurality of positioning slots 111 a with which the plurality of fixingbosses 125 are respectively matched. Forming the plurality ofpositioning slots 111 a by the sidewalls protruding outwardly preventsthe fixing bosses 125 from blocking the airflow within the air guidingcover 110. Further, the fixing bosses 125 cooperate with the positioningslots 111 a for positioning.

Further, a mounting portion 127 for fixing the second electronic module300 may be provided on the surface of the heat conduction plate 120 thatfaces away from the air duct 111 of the air guiding cover 110, tofacilitate the mounting of the second electronic module 300. In theillustrated embodiment, the mounting portion 127 is a mounting bossprovided on the surface of the heat conduction plate 120 that faces awayfrom the air duct 111.

Further, a blocking border 128 may also be provided on the surface ofthe heat conduction plate 120 that faces away from the air duct 111. Theregion enclosed by the blocking border 128 forms an avoidance portionwithin which an electronic device of the second electronic module 300may be received.

Further, the air guiding cover 110 may also comprise a flow guidingplate 116 disposed within the air duct 111. A flow guiding face 116 c ofthe flow guiding plate 116 is disposed aslope relative to the extendingdirection of the air duct 111, to form a flow converging portion with agradually narrowing width at the middle section of the air duct 111. Anend of the flow converging portion with a greater width is disposed toface the air inlet 112.

For example, in the illustrated embodiment, the flow guiding plate 116is located at a side of the first electronic module 200, which causesthe air within the air duct 111 of the air guiding cover 110 to flowtowards the first electronic module 200 through the flow guiding plate116, which further improves the heat dissipation efficiency for thefirst electronic module 200.

The specific structure of the flow guiding plate 116 may be designedaccording to different requirements. For example, in the illustratedembodiment, the flow guiding plate 116 comprises a main plate body 116 aand a connecting plate 116 b disposed at a back side of the main platebody 116 a. The connecting plate 116 b is fixedly connected with asidewall of the air duct 111 to fix the flow guiding plate 116 withinthe air duct 111. A front side of the main plate body 116 a forms theflow guiding face 116 c.

In some other embodiments, the flow guiding plate 116 further comprisesa hook located on an edge of the main plate body 116 a. The sidewall ofthe air duct 111 is provided with a snap groove which corresponds to thehook. The hook can be snapped with the snap groove to fix the main platebody 116 a within the air duct 111. The front side of the main platebody 116 a forms the flow guiding face 116 c.

Further, the shape of the flow guiding face 116 c may be designedaccording to different requirements. For example, the flow guiding face116 c may be a concave arc face, a convex arc face or a plane.

Further, the flow guiding face 116 c may disposed according to differentrequirements. For example, in the illustrated embodiment, the flowguiding face 116 c is disposed perpendicular to the sidewall of the airduct 111 that is provided with the mounting window 114.

In some other embodiments, the flow guiding face 116 c is disposedfacing the sidewall of the air duct 111 that is provided with themounting window 114.

In some embodiments, as shown in the figures, the heat dissipationdevice 110 further includes a fan 130. The airflow from the fan 130 mayenter the air duct 111 via the air inlet 112.

Arrangement of the fan 130 may be designed according to differentrequirements. For example, in the illustrated embodiment, the fan 130 ismounted at the air inlet 112 of the air guiding cover 110, and awind-out side of the fan 130 is disposed towards the air duct 111 of theair guiding cover 110, such that the fan 130 is directly incommunication with the air inlet 112.

In some other embodiments, the fan 130 is in communication with the airinlet 112 via a flow guiding channel. For example, the fan 130 can bedisposed at another part of the UAV 10, and in communication with theair duct 111 of the air guiding cover 110 via the flow guiding channelinside the UAV 10. In some embodiments, the fan 130 is disposed at aposition on the UAV 10 that is far away from the air guiding cover 110.A portion of the airflow generated by the fan 130 is guided to the airguiding cover 110 via the flow guiding channel inside the UAV 10, andanother portion of the airflow is guided to a power supply of the UAV 10to dissipate the heat generated by the power supply.

The fan 130 may be mounted in different manners according to differentrequirements. For example, in the illustrated embodiment, an opening endside of the air inlet 112 is provided with a plurality of positioningposts 117. Correspondingly, an edge of the fan 130 is provided with aplurality of positioning holes 131. The plurality of positioning posts117 can be inserted through the plurality of locating holes 131,respectively, to position the fan 130 on the opening end side of the airinlet 112.

In some other embodiments, the heat dissipation device 100 furthercomprises a fan support through which the fan 130 is fixed on theopening end side of the air inlet 112.

Further, the heat dissipation device 100 may also comprise a mountinghousing 140 disposed at a side of the heat conduction plate 120 thatfaces away from the air duct 111 of the air guiding cover 110. Themounting housing 140 and the heat conduction plate 120 jointly form anelectrical box for receiving the second electronic module 300.

In the illustrated embodiment, the mounting housing 140 comprises abottom plate 141 and a plurality of side plates 143. The plurality ofside plates 143 are connected in sequence to enclose a loop-like closedstructure and are connected with edges of the bottom plate 141. Thebottom plate 141 is disposed opposite to the heat conduction plate 120.The edges of the plurality of side plates 143 that are distal from thebottom plate 141 form an opening having a shape matching the shape of anoutline of the heat conduction plate 120.

Further, a connecting window 141 a for receiving an external plug and/ora heat dissipation window 141 b for exposing an electronic component maybe disposed on the bottom plate 141.

The manner for connecting the mounting housing 140 with the heatconduction plate 120 may be designed according to differentrequirements. For example, in the illustrated embodiment, the heatdissipation device 100 further comprises a connecting support 150 whichfixedly connects the heat conduction plate 120 with the mounting housing140.

The specific structure of the connecting support 150 may be designedaccording to different requirements. For example, in the illustratedembodiment, the connecting support 150 has a Z-shaped structure andcomprises a connecting body 151 and two fixing portions 153 which aredisposed at two ends of the connecting body 151, respectively. The twofixing portions 153 are fixedly connected with the heat conduction plate120 and the mounting housing 140, respectively.

Further, the connecting body 151 may have a sheet-shaped structure. Thetwo fixing portions 153 are folded sheets which are bent and extend fromthe two ends of the connecting body 151, respectively. One of thesidewalls 143 of the mounting housing 140 may be provided with a snaphole 143 a (as shown in FIG. 3). One of the fixing portions 153 isinserted in the snap hole 143 a, and the other one of the fixingportions 153 is disposed clingingly at the surface of the heatconduction plate 120 that is close to the air duct 111 of the airguiding cover 110.

Further, the heat dissipation device 100 may also comprise a fixingsupport 160 for fixing the air guiding cover 110. For example, the heatdissipation device 100 may be fixed to the body of the UAV 10 via thefixing support 160.

The fixing support 160 may be mounted in different manners according todifferent requirements. For example, in the illustrated embodiment,there are two fixing supports 160, one of which is fixedly connectedwith the air guiding cover 110, and the other one of is fixedlyconnected with the heat conduction plate 120.

The specific structure of the fixing support 160 may be designedaccording to different requirements. For example, in the illustratedembodiment, the fixing support 160 comprises a U-shaped body 161 and twoconnecting lugs 163. The U-shaped body 161 may comprise a bottom and twoarms which extend from two ends of the bottom, respectively, towards thesame side of the bottom. The two connecting lugs 163 are disposedopposite to and spaced apart from each other, and on an outer side ofthe bottom of the U-shaped body 161 that is opposite to the side onwhich the arms of the U-shaped body 161 are disposed. Further, theconnecting lugs 163 extend in a direction perpendicular to the bottom ofthe U-shaped body 161 and facing away from the arms of the U-shaped body161.

In the illustrated embodiment, the first electronic module 200 isreceived within the air duct 111 of the air guiding cover 110, anddisposed spaced away from the heat conduction plate 120. The secondelectronic module 300 is disposed on a surface of the heat conductionplate 120 that faces away from the air duct 111 of the air guiding cover110. The heat generated by the second electronic module 300 is conductedonto the heat conduction plate 120. The heat generated by the heatconduction plate 120 and the first electronic module 200 is taken awayby the airflow circulating within the air duct 110.

The heat generated by the first electronic module 200 may be more thanor less than the heat generated by the second electronic module 300. Inthe illustrated embodiment, the first electronic module 200 is an IMUmodule, and the second electronic module 300 is an OFDM module. The heatgenerated by the IMU module is generally less than the heat generated bythe OFDM. The IMU module is separated from the electrical box by the airguiding cover 110 and the heat conduction plate 120, and the heatgenerated by the IMU module can be dissipated separately.

Further, the heat dissipation device 100 may also comprise a mountingsupport 170 for fixing the first electronic module 200. The mountingsupport 170 is located within the air duct 111 of the air guiding cover110. Specifically, the mounting support 170 spaces the first electronicmodule 200 apart from the heat conduction plate 120, to prevent the heatin the heat conduction plate 120 from passing directly onto the firstelectronic module 200.

The mounting support 170 may be connected in different manners accordingto different requirements. For example, in the illustrated embodiment,the mounting support 170 is fixedly connected with the surface of theheat conduction plate 120 that is close to the air duct 111, such thatthe first electronic module 200 may be detached together with the heatconduction plate 120, to facilitate the repair the first electronicmodule 200.

In some other embodiments, the mounting support 170 is fixedly connectedwith a sidewall of the air duct 111.

Further, in order to avoid the heat in the heat conduction plate 120from being dissipated via the mounting support 170, the mounting support170 is a thermal insulation support and detachably connected with theheat conduction plate 120.

The specific structure of the mounting support 170 may be designedaccording to different requirements. For example, in the illustratedembodiment, the mounting support 170 comprises a U-shaped plate body 171and fixing lugs 173 bending from two ends of the U-shaped plate body171, respectively. The fixing lugs 173 extend in opposite directions.The U-shaped plate body 171 is provided with hollow portions 171 a fordissipating heat. A clamping space is formed in the U-shaped plate body171. That is, the first electronic module 200 is clamped within theU-shaped plate body 171. The fixing lugs 173 are fixedly connected withthe surface of the heat conduction plate 120 that is close to the airduct 111.

In some other embodiments, the mounting support 170 comprises aplurality of L-shaped frames. One end of each L-shaped frame is fixed onthe surface of the heat conduction plate 120 that is close to the airduct 111. Another end of each L-shaped frame is disposed in parallel toand spaced away from the heat conduction plate 120, and abuts againstthe first electronic module 200. A clamping space is formed between thetwo L-shaped frames which are disposed opposite to each other. That is,the first electronic module 200 is clamped between the two L-shapedframes which are disposed opposite to each other.

Further, the UAV 10 may also comprise a third electronic module 400which is disposed at a side of the second electronic module 300 thatfaces away from the heat conduction plate 120. In the illustratedembodiment, the third electronic module 400 is a control module.

When the above-described heat dissipation device 100 starts to work, thefirst electronic module 200 is isolated from the second electronicmodule 300 by the heat conduction plate 120. The first electronic module200 is fixed within the air duct 111 of the air guiding cover 110, thesecond electronic module 300 is located outside the air duct 111 of theair guiding cover 110 and fixed on a surface of the heat conductionplate 120 that faces away from the air duct 111. The airflow generatedby the fan 130 may blow downward from the top of the first electronicmodule 200, be converged to the surface of the first electronic module200 by the air duct 111 of the air guiding cover 110, and flow awaythrough a space between the heat dissipation fins 123 of the heatconduction plate 120, to take away the heat on the surface of the firstelectronic module 200 and the heat dissipated from the second electronicmodule 300 to the heat conduction plate 120, so as to reduce thetemperature.

As compared with a traditional UAV, the above-described UAV 10 has atleast the following advantages:

(1) The above described UAV 10 employs the heat dissipation device 100to dissipate the heat generated by a plurality of electronic modulesseparately, thereby preventing the heat generated by one electronicmodule from influencing another electronic module, such that theplurality of electronic modules can operate in different environmentaltemperatures. Further, the heat generated by various electronic modulescan be taken away quickly via the airflow circulating within the airduct 111 of the air guiding cover 110.

For example, the IMU module is disposed within the air duct 111 of theair guiding cover 110. The heat generated by the IMU module can be takenaway directly by the airflow within the air duct 111 of the air guidingcover 110. The OFDM module is located outside the air guiding cover 110and fixed on the heat conduction plate 120. The heat generated by theOFDM module is conducted to the heat conduction plate 120 and taken awayby the airflow within the air duct 111 of the air guiding cover 110.

(2) The heat conduction plate 120 of the above-described heatdissipation device 100 directly constitutes a portion of the sidewallsof the air duct 111 of the air guiding cover 100, such that the heatgenerated by the second electronic module 300 can be dissipated directlyvia the heat conduction plate 120, thereby improving the heatdissipation efficiency for the second electronic module 300.

(3) The second electronic module 300 of the above-described UAV 10 isfixed directly on the heat conduction plate 120, which is fixed on theair guiding cover 110. This allows the second electronic module 300 tobe more firmly fixed in the UAV 10, thus avoiding bad electrical contactin the second electronic module 300 when the UAV 10 flies and vibrates.Further, the strength of the whole structure of the UAV 10 is enhanced,meeting the requirement of the strength on the structure of the UAV 10.

The foregoing description is merely illustrative of the embodiments ofthe disclosure, and is not intended to limit the scope of thedisclosure. Any equivalent structural or flow variations made on thebasis of the description and the drawings of the disclosure, and theirdirect or indirect application to other relevant technical fields, shallall fall into the scope of the disclosure.

What is claimed is:
 1. An unmanned aerial vehicle (UAV), comprising: aheat dissipation device comprising: an air guiding cover comprising anair duct configured to guide an airflow; and a heat conduction platedirectly constituting a portion of a sidewall of the air duct; aninertial measurement unit (IMU) module received within the air duct; anda control module located outside the air duct and disposed at a side ofthe heat conduction plate that faces away from the IMU module; whereinheat generated by the IMU module is taken away directly by the airflowwithin the air duct.
 2. The UAV of claim 1, wherein the air guidingcover further comprises an air inlet formed at a first end of the airduct and an air outlet formed at a second end of the air duct.
 3. TheUAV of claim 2, wherein an opening size of the air inlet is greater thanan opening size of the air outlet.
 4. The UAV of claim 2, wherein: thesidewall comprises a plane-shaped mounting sidewall on which a mountingwindow is formed; and the heat conduction plate comprises a plane-shapedplate body covering the mounting window.
 5. The UAV of claim 4, wherein:the mounting window extends from the first end of the air duct to thesecond end of the air duct, and extends all the way through the airoutlet, and the plate body extends to the air outlet and forms the airoutlet jointly with other sidewalls of the air duct.
 6. The UAV of claim2, wherein the sidewall is a first sidewall; the UAV further comprising:a midstream guiding face formed at a middle section of a second sidewallof the air duct and configured to converge the airflow towards the airoutlet, the second sidewall being opposite to the first sidewall.
 7. TheUAV of claim 6, wherein the midstream guiding face includes a convexcurved face or an inclined plane.
 8. The UAV of claim 2, the sidewall isa first sidewall; the UAV further comprising: an upstream guiding faceformed on a second sidewall of the air duct at a location close to theair inlet and configured to converge an airflow from the air inlettowards a middle section of the air duct, the second sidewall beingopposite to the first sidewall.
 9. The UAV of claim 8, wherein theupstream guiding face includes a convex curved face or an inclinedplane.
 10. The UAV of claim 1, wherein: the air duct comprises amounting window formed on the sidewall of the airduct; and the heatconduction plate comprises: a plate body sealing the mounting window;and a plurality of heat dissipation fins disposed on a surface of theplate body that faces the air duct.
 11. The UAV of claim 10, wherein ahollow region is formed among the plurality of heat dissipation fins.12. The UAV of claim 10, wherein the plurality of heat dissipation finsare disposed substantially in parallel and spaced apart from each otherto form a plurality of flow guiding grooves which are disposed along anextending direction parallel to the air duct.
 13. The UAV of claim 1,wherein the air guiding cover further comprises a flow guiding platedisposed within the air duct, a flow guiding face of the flow guidingplate being disposed aslope relative to an extending direction of theair duct to form a flow converging portion with a gradually narrowingwidth at a middle section of the air duct, and an end of the flowconverging portion with a larger width being disposed towards an airinlet formed at an end of the air duct.
 14. The UAV of claim 13,wherein: the sidewall is a first sidewall; and the flow guiding platecomprises a main plate body and a connecting plate disposed at a backside of the main plate body, the connecting plate being fixedlyconnected with a second sidewall of the air duct to fix the flow guidingplate within the air duct, and the flow guiding face including a frontside of the main plate body.
 15. The UAV of claim 13, wherein: thesidewall is a first sidewall; the flow guiding plate comprises a mainplate body and a hook located on an edge of the main plate body, theflow guiding face including a front side of the main plate body; the airduct comprises a snap structure on a second sidewall of the air duct;and the hook is snapped with the snap groove to fix the main plate bodywithin the air duct.
 16. The UAV of claim 1, further comprising: anelectronic module arranged at the side of the heat conduction plate thatfaces away from the IMU module.
 17. The UAV of claim 16, wherein the IMUmodule generates more heat than the electronic module when the UAVoperates.
 18. The UAV of claim 17, wherein: the electronic moduleincludes an orthogonal frequency-division multiplexing (OFDM) module;and the IMU module, the OFDM module, and the control module form a maincontrol of the UAV.
 19. The UAV of claim 16, wherein the electronicmodule includes an orthogonal frequency-division multiplexing module.20. The UAV of claim 16, wherein: the heat conduction plate includes amounting portion provided on the side of the heat conduction plate thatfaces away from the IMU module; and the electronic module is fixed atthe mounting portion.